Silicon Devices and Process Integration
Deep Submicron and Nano-Scale Technologies
(Sprache: Englisch)
Compiled from industrial and academic lecture notes and reflecting years of experience in the development of silicon devices, this book covers both their theoretical and practical aspects, and how their electrical properties and processing conditions interact.
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Produktinformationen zu „Silicon Devices and Process Integration “
Compiled from industrial and academic lecture notes and reflecting years of experience in the development of silicon devices, this book covers both their theoretical and practical aspects, and how their electrical properties and processing conditions interact.
Klappentext zu „Silicon Devices and Process Integration “
Silicon Devices and Process Integration covers state-of-the-art silicon devices, their characteristics, and their interactions with process parameters. It serves as a comprehensive guide which addresses both the theoretical and practical aspects of modern silicon devices and the relationship between their electrical properties and processing conditions. The book is compiled from the author's industrial and academic lecture notes and reflects years of experience in the development of silicon devices. Features include:
- A review of silicon properties which provides a foundation for understanding the device properties discussion, including mobility-enhancement by straining silicon;
- State-of-the-art technologies on high-K gate dielectrics, low-K dielectrics, Cu interconnects, and SiGe BiCMOS;
- CMOS-only applications, such as subthreshold current and parasitic latch-up;
- Advanced Enabling processes and process integration.
This book is written for engineers and scientists in semiconductor research, development and manufacturing. The problems at the end of each chapter and the numerous charts, figures and tables also make it appropriate for use as a text in graduate and advanced undergraduate courses in electrical engineering and materials science.
Inhaltsverzeichnis zu „Silicon Devices and Process Integration “
- Properties of the Silicon Crystal. Valence-bond and energy-band models. Thermal equilibrium statistics. Carrier transport mechanisms. Non-equilibrium conditions and carrier lifetime- Junctions and Contacts. Ohmic, non-ohmic, and rectifying contacts. PN junctions, homo- and hetero-junctions. Contact und junction characterization, parameter extraction. Varactors
- Junction Field-Effect Transistor, JFET. Structure and mode of operation. Physics of JFET. JFET characterization and parameter extraction. High-voltage applications. Parasitic effects
- Bipolar Junction Transistor, BJT. Structure and mode of operation. Physics of BJT. Heterojunction Bipolar Transistor, HBT. Transistor characterization and parameter extraction. High-voltage applications
- Parasitic effects
Bibliographische Angaben
- Autor: Badih El-Kareh
- 2009, XXVI, 598 Seiten, Maße: 16,4 x 24,6 cm, Gebunden, Englisch
- Verlag: Springer, Berlin
- ISBN-10: 0387367985
- ISBN-13: 9780387367989
Sprache:
Englisch
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