The Electronics Assembly Handbook

Systems, vision and components in electronics assembly.- Manging automated electronics assembly.- PCB production equipment.- Modern platers and etchers.- Chemicals in PCB manufacturing.- Cleaning PCBs for higher quality.- Producing quality multilayer PCBs.- Plasma desmearing.- Chip-on-board technology.- Chip-and-wire technology.- TAB and flip-chip technology.- Component insertion equipment.- Workstations.- Automatic component insertion/placement systems.- Automated pin insertion.- Automated placement techniques.- Assembly challenges.- Robots in the electrical and electronics industry.- Consistency and quality using robots.- Robot hand exchangers.- Vision-guided assembly.- Vibratory insertion process: A new approach to non-standard component insertion.- SMT growth.- Realizing the benefits of SMT.- Designing reliability into surface-mount assemblies.- Design solutions.- Choosing SMT and setting up a facility.- SMT advantages.- Pick-and-place machines.- Surface-mount assembly using machine vision.- SMD placement using machine vision.- Hot-air leveling.- Testability circuit and board access problems.- Conductive epoxy for SMT solder replacement.- The removal and replacement of SMCs.- New applications.- New materials and equipment.- Integral substrate package technology.- Solder/cleaning, test and rework.- Solder joint acceptability.- Wave solder defects.- Soldering system trends.- Wave soldering: A study in process control.- Optimizing the wave soldering process.- Computerized soldering systems.- Re-examination of soldering techniques.- Adhesives for SMD wave soldering.- Adhesive evaluation.- Solder coating and leveling.- Screen printing.- Solvent flushing.- Rosin solder flux residues.- Aqueous cleaning.- Cleaning surface-mounted assemblies.- Desoldering components.- Bare-board testing.- Automatic optical inspection systems.- Machine vision.- Component testers and handlers.- Handlers.- Lead scanning.- Probe design and test fixturing.- Inspection equipment.- Image