Thermal Management Materials for Electronic Packaging

OVERVIEW OF WORKS PHYSICAL BASIS OF THERMAL CONDUCTION Basic Concepts and Laws of Thermal Conduction Heat Conduction Differential Equation and Finite Solution Heat Conduction Mechanism and Theoretical Calculation Thermal Conductivity of Solids ELECTRONIC PACKAGING MATERIALS FOR THERMAL MANAGEMENT Definition and Classification of Electronic Packaging Thermal Management in Electronic Equipment Require of Electronic Packaging Materials Electronic Packaging Materials CHARACTERIZATION METHODS FOR THERMAL MANAGEMENT MATERIALS Overview of the Development of Thermal Conductivity Test Methods Test Method Classification and Standards Steady-State Method Non-Steady-State Method Electrical Properties and Measurement Techniques Material Characterization Analysis Technology Reliability Analysis and Environmental Performance Evaluation CONSTRUCTION OF THERMAL CONDUCTIVITY NETWORK AND PERFORMANCE OPTIMIZATION OF POLYMER SUBSTRATE Synthesis and Surface Modification of High Thermal Conductive Filler and the Synthesis of Substrates Study on Polymer Thermal Conductive Composites with Oriented Structure Preparation of Thermal Conductive Composites with Inorganic Ceramic Skeleton Structure Assembly of Thermal Conductive Materials in Different Dimensions and Preparation of Composite Materials Conclusion OPTIMAL DESIGN OF HIGH THERMAL CONDUCTIVE METAL SUBSTRATE SYSTEM FOR HIGH POWER DEVICES Power Devices and Thermal Conduction Optimization and Adaptability Design, Preparation and Modification of High Thermal Conductive Matrix and Components Formation and Evolution Rules of High Thermal Conductive Interface and its Control Method Formation and Evolution Rules of High Thermal Conductive Composite Microstructure and its Control Method PREPARATION AND PERFORMANCE STUDY OF SILICON NITRIDE CERAMIC SUBSTRATE WITH HIGH THERMAL CONDUCTIVITY Rapid Nitridation of Silicon Compact and Tape Casting of Silicon Optimization of Sintering Aids for High Thermal Conductivity Si3N4 Ceramics Investigation of

Xingyou Tian, Professor, is Deputy Director of Institute for Solid State Physics (ISSP), Hefei Institutes of Physical Science, Chinese Academy of Sciences and Director of the Key Laboratory of Photovoltaic and Energy-Saving Materials of the Chinese Academy of Sciences. His main research includes key functional materials for electronic devices, integrated circuit heat dissipation materials, polymer nanocomposite materials, and new energy-saving and environmentally friendly materials.