VLSI-Soc: From Systems to Chips: Ifip Tc 10/Wg 10.5, Twelfth International Conference on Very Large Scale Ingegration of System on Chip (VLSI-Soc 2003
(Sprache: Englisch)
This book presents extended and revised versions of the best papers that were presented during the twelfth edition of the IFIP TC10 Working Group 10.5 International Conference on Very Large Scale Integration. The purpose of this conference was to provide a...
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This book presents extended and revised versions of the best papers that were presented during the twelfth edition of the IFIP TC10 Working Group 10.5 International Conference on Very Large Scale Integration. The purpose of this conference was to provide a forum to exchange ideas and show research results in the field of microelectronics design. The current trend toward increasing chip integration brings about exhilarating new challenges both at the physical and system-design levels. This book aims to address these exciting issues. TOC:Effect of Power Optimizations on Soft Error Rate.- Dynamic Models for Substrate Coupling in Mixed-Mode Systems.- Automated Conversion of SystemC Fixed- Point Data Types.- Validation of Asynchronous Circuit Specifications Using IF/CADP.- Optimizing SOC Test Resources Using Dual Sequences.- Evaluation Methodology for Single Electron Encoded Threshold Logic Gates.- Stuck-at-Fault Testability of SPP Three-Level Logic Forms.
Inhaltsverzeichnis zu „VLSI-Soc: From Systems to Chips: Ifip Tc 10/Wg 10.5, Twelfth International Conference on Very Large Scale Ingegration of System on Chip (VLSI-Soc 2003 “
Effect of Power Optimizations on Soft Error Rate.- Dynamic Models for Substrate Coupling in Mixed-Mode Systems.- Automated Conversion of SystemC Fixed- Point Data Types.- Validation of Asynchronous Circuit Specifications Using IF/CADP.- Optimizing SOC Test Resources Using Dual Sequences.- Evaluation Methodology for Single Electron Encoded Threshold Logic Gates.- Stuck-at-Fault Testability of SPP Three-Level Logic Forms.
Bibliographische Angaben
- 2006, 316 Seiten, Maße: 15,7 x 23,6 cm, Gebunden, Englisch
- Herausgegeben: Manfred Glesner, Ricardo Reis, Leandro Indrusiak
- Verlag: Springer-Verlag GmbH
- ISBN-10: 0387334025
- ISBN-13: 9780387334028
Sprache:
Englisch
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