Flexible Electronic Packaging and Encapsulation Technology (PDF)
(Sprache: Englisch)
Systematically introduces and summarizes the fundamental and experimental research results of recent progress on flexible electronic packaging and encapsulation technology.
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Systematically introduces and summarizes the fundamental and experimental research results of recent progress on flexible electronic packaging and encapsulation technology.
Autoren-Porträt
Prof. Hong Meng received his Ph.D. from University of California Los Angeles (UCLA) in 2002. He has been working in the field of organic electronics for more than 30 years. His career experiences including working at the Institute of Materials Science and Engineering (IMRE) in Singapore, Lucent Technologies Bell Labs, DuPont Experimental Station. In 2014, he moved to School of Advanced Materials at Peking University Shenzhen Graduate School. He has contributed over 230 peer-reviewed papers (citation: 11000) in chemistry and materials science fields, filed over 46 US patents, 140 Chinese patents.Professor Wei Huang obtained his BSc, MSc and PhD from the Department of Chemistry, Peking University in 1983, 1988, and 1992, respectively. After teaching Physical Chemistry in Peking University from 1992 to 1993, he began his postdoctoral research with National University of Singapore (NUS) since 1995. In November 2011, he was elected as Academician of the Chinese Academy of Sciences (CAS). In April 2017, he was appointed as Deputy President & Provost of Northwestern Polytechnical University, China.
Bibliographische Angaben
- 2024, 1. Auflage, 384 Seiten, Englisch
- Herausgegeben: Hong Meng, Wei Huang
- Verlag: Wiley-VCH
- ISBN-10: 3527845704
- ISBN-13: 9783527845705
- Erscheinungsdatum: 20.03.2024
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- Größe: 16 MB
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