Lead-Free Solder Process Development (PDF)
(Sprache: Englisch)
Discusses the growth mechanisms of tin whiskers and the effective mitigation strategies necessary to reduce whisker growth risks
This book covers key tin whisker topics, ranging from fundamental science to practical mitigation strategies. The text begins...
This book covers key tin whisker topics, ranging from fundamental science to practical mitigation strategies. The text begins...
sofort als Download lieferbar
eBook (pdf)
107.99 €
- Lastschrift, Kreditkarte, Paypal, Rechnung
- Kostenloser tolino webreader
Produktdetails
Produktinformationen zu „Lead-Free Solder Process Development (PDF)“
Discusses the growth mechanisms of tin whiskers and the effective mitigation strategies necessary to reduce whisker growth risks
This book covers key tin whisker topics, ranging from fundamental science to practical mitigation strategies. The text begins with a review of the characteristic properties of local microstructures around whisker and hillock grains to identify why these particular grains and locations become predisposed to forming whiskers and hillocks. The book discusses the basic properties of tin-based alloy finishes and the effects of various alloying elements on whisker formation, with a focus on potential mechanisms for whisker suppression or enhancement for each element. Tin whisker risk mitigation strategies for each tier of the supply chain for high reliability electronic systems are also described.
* Discusses whisker formation factors including surface grain geometry, crystallographic orientation-dependent surface grain boundary structure, and the localization of elastic strain/strain energy density distribution
* Examines how whiskers and hillocks evolve in time through real-time studies of whisker growth with the scanning electron microscope/focused ion beaming milling (SEM/FIB)
* Covers characterization methods of tin and tin-based alloy finishes such as transmission electron microscopy (TEM), scanning electron microscopy (SEM), and electron backscatter diffraction (EBSD)
* Reviews theories of mechanically-induced tin whiskers with case studies using pure tin and other lead-free finishes shown to evaluate the pressure-induced tin whiskers
Mitigating Tin Whisker Risks: Theory and Practice is intended for the broader electronic packaging and manufacturing community including: manufacturing engineers, packaging development engineers, as well as engineers and researchers in high reliability industries.
This book covers key tin whisker topics, ranging from fundamental science to practical mitigation strategies. The text begins with a review of the characteristic properties of local microstructures around whisker and hillock grains to identify why these particular grains and locations become predisposed to forming whiskers and hillocks. The book discusses the basic properties of tin-based alloy finishes and the effects of various alloying elements on whisker formation, with a focus on potential mechanisms for whisker suppression or enhancement for each element. Tin whisker risk mitigation strategies for each tier of the supply chain for high reliability electronic systems are also described.
* Discusses whisker formation factors including surface grain geometry, crystallographic orientation-dependent surface grain boundary structure, and the localization of elastic strain/strain energy density distribution
* Examines how whiskers and hillocks evolve in time through real-time studies of whisker growth with the scanning electron microscope/focused ion beaming milling (SEM/FIB)
* Covers characterization methods of tin and tin-based alloy finishes such as transmission electron microscopy (TEM), scanning electron microscopy (SEM), and electron backscatter diffraction (EBSD)
* Reviews theories of mechanically-induced tin whiskers with case studies using pure tin and other lead-free finishes shown to evaluate the pressure-induced tin whiskers
Mitigating Tin Whisker Risks: Theory and Practice is intended for the broader electronic packaging and manufacturing community including: manufacturing engineers, packaging development engineers, as well as engineers and researchers in high reliability industries.
Autoren-Porträt
GREGORY HENSHALL is Master Engineer at Hewlett-PackardCompany in Palo Alto, California. He has more than twenty years'
experience in materials research and development, including twelve
years of experience with soldering alloys and electronics
manufacturing and nine years focused on lead-free technology. Dr.
Henshall currently serves as chair for the iNEMI (International
Electronics Manufacturing Initiative) Lead-Free Alloy Alternatives
Project.
JASBIR BATH is the owner of Bath Technical Consultancy
LLC in Fremont, California. He has over fifteen years' experience
in research, design, development, and implementation in the areas
of soldering, surface mount, and packaging technologies working for
companies including Flextronics International/Solectron Corporation
and ITRI (International Tin Research Institute). Bath has been
chair of various iNEMI lead-free consortia involving OEMs, EMS, and
component and material supplier companies on alloy selection,
assembly, and rework.
CAROL A. HANDWERKER is the Reinhardt Schuhmann Jr.
Professor of Materials Engineering at Purdue University, Indiana.
Previously, she was chief of the Metallurgy Division at the
National Institute of Standards and Technology (NIST), where she
participated in the NCMS (National Center for Manufacturing
Sciences) Lead-Free Solder Project and co-chaired the iNEMI
Lead-Free Alloy Selection Team. Dr. Handwerker is currently active
on the iNEMI Technical, Research, and Environmental Leadership
Steering Committees, as well as a participant in a range of iNEMI
project teams.
Bibliographische Angaben
- 2011, 1. Auflage, 284 Seiten, Englisch
- Herausgegeben: Gregory Henshall, Jasbir Bath, Carol A. Handwerker
- Verlag: John Wiley & Sons
- ISBN-10: 0470901187
- ISBN-13: 9780470901182
- Erscheinungsdatum: 12.05.2011
Abhängig von Bildschirmgröße und eingestellter Schriftgröße kann die Seitenzahl auf Ihrem Lesegerät variieren.
eBook Informationen
- Dateiformat: PDF
- Größe: 14 MB
- Mit Kopierschutz
Sprache:
Englisch
Kopierschutz
Dieses eBook können Sie uneingeschränkt auf allen Geräten der tolino Familie lesen. Zum Lesen auf sonstigen eReadern und am PC benötigen Sie eine Adobe ID.
Kommentar zu "Lead-Free Solder Process Development"
0 Gebrauchte Artikel zu „Lead-Free Solder Process Development“
Zustand | Preis | Porto | Zahlung | Verkäufer | Rating |
---|
Schreiben Sie einen Kommentar zu "Lead-Free Solder Process Development".
Kommentar verfassen