Recent Progress in Lead-Free Solder Technology / Topics in Mining, Metallurgy and Materials Engineering (PDF)

academics and professionals in collaboration with the microelectronics industries in Malaysia. His research interest in Thermofluids and Computational Fluid Dynamics, focusing on Soldering, Surface Mount Technology, and Advanced Packaging. He also registered with the Board of Engineers Malaysia and a fellow Electronics Packaging Research Society, Malaysia.
Azman Jalar (Ph.D) is a professor of applied metallurgy from the Faculty of Science and Technology, and Principal Research Fellow in electronics packaging at the Institute of Microengineering and Nanoelectronics, Universiti Kebangsaan Malaysia. Graduated with PhD degree in metallurgy and materials from School of Metallurgy and Materials, University of Birmingham, UK in 2001. His interest in microstructure-properties-performance or materials science paradigm motivates him to conduct research in electronic packaging since 2002. He also interested in electronicmaterials, nanomaterials, materialography and stereometry. He has significantly contributed in solving many industrial-related semiconductor packaging problems through industry-driven research activities. Past and current research projects including packaging materials, solder materials and soldering, wire bonding and package architecture. Past projects collaborated with Freescale, OnSemi, AIC semiconductor, Celestica, Jabil electronics and Infineon, and ongoing projects with Nexperia, Western Digital and RedRing Solder.
Mohd Izrul Izwan Ramli (Ph.D) received his PhD from the Universiti Malaysia Perlis (UniMAP) Malaysia in materials engineering majoring in the development of solder materials . Now he works as a postdoctoral researcher in Universiti Malaysia Perlis (UniMAP) working on several projects related to the development of solder materials. His current research interest is in materials engineering and focusing on the development of lead-free solder alloys for electric/electronic interconnects. His research activities including using advance material characterizations techniques such as the synchrotron imaging, synchrotron XRF and synchrotron tomography and have contributed to several leading discoveries in solder alloy development. He has published 57 journals in leading journals in his research area with total citation 179 and H-index: 9. He also received several international research grants as co researcher during his studies and postdoctoral period. He has now more than 5 patents and copyrights in the lead-free solder alloy area.