Split Manufacturing of Integrated Circuits for Hardware Security and Trust (PDF)

Globalization of the integrated circuit (IC) supply chains led to many potential vulnerabilities. Several attack scenarios can exploit these vulnerabilities to reverse engineer IC designs or to insert malicious trojan circuits.

Split manufacturing refers to the process of splitting an IC design into multiple parts and fabricating these parts at two or more foundries such that the design is secure even when some or all of those foundries are potentially untrusted. Realizing its security benefits, researchers have proposed split fabrication methods for 2D, 2.5D, and the emerging 3D ICs. Both attack methods against split designs and defense techniques to thwart those attacks while minimizing overheads have steadily progressed over the past decade.

This book presents a comprehensive review of the state-of-the-art and emerging directions in design splitting for secure split fabrication, design recognition and recovery attacks against split designs, and design techniques to defend against those attacks. Readers will learn methodologies for secure and trusted IC design and fabrication using split design methods to protect against supply chain vulnerabilities.

• Provides the first book on Split Manufacturing methods, attacks and defenses for integrated circuits;
• Serves as single-source reference to all advances to-date on split manufacturing methods and design splitting techniques for 2D, 2.5D and 3D integrated circuits, design recovery attacks and defense methods;
• Covers design constraint based attacks and satisfiability based attacks to reverse engineer split designs or to insert hardware trojans;
• Covers design-for-trust defense techniques to thwart both reverse engineering and trojan insertion attacks;
• Discusses the security benefits and cost penalties of various split design methods;
• Includes challenges and emerging research directions.