Vertical 3D Memory Technologies (ePub)
(Sprache: Englisch)
The large scale integration and planar scaling of individual
system chips is reaching an expensive limit. If individual chips
now, and later terrabyte memory blocks, memory macros, and
processing cores, can be tightly linked in optimally designed...
system chips is reaching an expensive limit. If individual chips
now, and later terrabyte memory blocks, memory macros, and
processing cores, can be tightly linked in optimally designed...
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The large scale integration and planar scaling of individual
system chips is reaching an expensive limit. If individual chips
now, and later terrabyte memory blocks, memory macros, and
processing cores, can be tightly linked in optimally designed and
processed small footprint vertical stacks, then performance can be
increased, power reduced and cost contained. This book reviews for
the electronics industry engineer, professional and student the
critical areas of development for 3D vertical memory chips
including: gate-all-around and junction-less nanowire memories,
stacked thin film and double gate memories, terrabit vertical
channel and vertical gate stacked NAND flash, large scale stacking
of Resistance RAM cross-point arrays, and 2.5D/3D stacking of
memory and processor chips with through-silicon-via
connections now and remote links later.
Key features:
* Presents a review of the status and trends in 3-dimensional
vertical memory chip technologies.
* Extensively reviews advanced vertical memory chip technology
and development
* Explores technology process routes and 3D chip integration in a
single reference
system chips is reaching an expensive limit. If individual chips
now, and later terrabyte memory blocks, memory macros, and
processing cores, can be tightly linked in optimally designed and
processed small footprint vertical stacks, then performance can be
increased, power reduced and cost contained. This book reviews for
the electronics industry engineer, professional and student the
critical areas of development for 3D vertical memory chips
including: gate-all-around and junction-less nanowire memories,
stacked thin film and double gate memories, terrabit vertical
channel and vertical gate stacked NAND flash, large scale stacking
of Resistance RAM cross-point arrays, and 2.5D/3D stacking of
memory and processor chips with through-silicon-via
connections now and remote links later.
Key features:
* Presents a review of the status and trends in 3-dimensional
vertical memory chip technologies.
* Extensively reviews advanced vertical memory chip technology
and development
* Explores technology process routes and 3D chip integration in a
single reference
Autoren-Porträt von Betty Prince
Dr Betty Prince has over 30 years' experience inthe semiconductor industry having worked with Texas Instruments,
N.V. Philips, Motorola, R.C.A., and Fairchild and is currently CEO
of Memory Strategies International. She has authored four books and
served from 1991-1994 on the Technical Advisory Board of IEEE
Spectrum magazine. She is a Senior Life Member of the IEEE and
served as an IEEE SSCS Distinguished Lecturer and on the Program
Committee of the IEEE Custom Integrated Circuit conference. She was
founder of the JEDEC JC-16 Interface Standards Committee and was
active for many years on the JC-42 Memory Committee where she was
co-chair of the SRAM standards group. She has been U.S.
representative to the IEC SC47A WG3 Memory Standards Committee. Dr
Prince has served on the Technical Advisory Board of several memory
companies and has been on the Board of Directors of Mosaid
Technologies. She holds patents in the memory, processor and
interface areas and has degrees in Physics, Math, and Finance with
doctoral dissertation in fractal modeling.
Bibliographische Angaben
- Autor: Betty Prince
- 2014, 1. Auflage, 368 Seiten, Englisch
- Verlag: John Wiley & Sons
- ISBN-10: 1118760468
- ISBN-13: 9781118760468
- Erscheinungsdatum: 13.08.2014
Abhängig von Bildschirmgröße und eingestellter Schriftgröße kann die Seitenzahl auf Ihrem Lesegerät variieren.
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- Dateiformat: ePub
- Größe: 9.50 MB
- Mit Kopierschutz
Sprache:
Englisch
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