Handbook of Thin Film Deposition
(Sprache: Englisch)
Handbook of Thin Film Deposition, Fourth Edition, is a comprehensive reference focusing on thin film technologies and applications used in the semiconductor industry and the closely related areas of thin film deposition, thin film micro properties,...
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Klappentext zu „Handbook of Thin Film Deposition “
Handbook of Thin Film Deposition, Fourth Edition, is a comprehensive reference focusing on thin film technologies and applications used in the semiconductor industry and the closely related areas of thin film deposition, thin film micro properties, photovoltaic solar energy applications, materials for memory applications and methods for thin film optical processes. The book is broken up into three sections: scaling, equipment and processing, and applications. In this newly revised edition, the handbook will also explore the limits of thin film applications, most notably as they relate to applications in manufacturing, materials, design and reliability. - Offers a practical survey of thin film technologies aimed at engineers and managers involved in all stages of the process: design, fabrication, quality assurance, applications and the limitations faced by those processes
- Covers core processes and applications in the semiconductor industry and new developments within the photovoltaic and optical thin film industries
- Features a new chapter discussing Gates Dielectrics
Inhaltsverzeichnis zu „Handbook of Thin Film Deposition “
Section 1 - SCALING 1. A Perspective on Today's Scaling Challenges and Possible Future Direction 2. Limits and Hurdles To Continued Cmos Scaling 3. Reliability Issues: Reliability Imposed Limits to Scaling 4. Thermal Engineering at the Limits of the CMOS Era Section 2 - THIN FILM DEPOSITION EQUIPMENT AND PROCESSING 5. Limits Of Gate Dielectrics Scaling 6. Process Technology for Copper Interconnects 7. Sputter Processing 8. Thin Film Deposition for Front End of Line: The Effect of the Semiconductor Scaling, Strain Engineering and Pattern Effects 9. Equipment in CVD Processing 10. CMP Method and Practice 11. Atomic Layer Deposition: Fundamentals, Practice and Challenges 12. Optical Thin Films 13. Semiconductor Memory
Autoren-Porträt von Krishna Seshan
Formerly Assistant Professor in Materials Science at the University of Arizona and has extensive professional experience as a technologist with both the IBM and Intel Corporations. Dr. Seshan passed away in 2017. Dominic Schepis has over 35 years in the semiconductor industry supporting Logic and Memory technologies. As Principal Member of the Technical Staff at GlobalFoundries, Dominic worked on process development and integration for 14nm and advanced node CMOS technologies. His early work on SOI CMOS integration led to the first IBM Mainframes to use this technology. He also served on the patent evaluation board at IBM and GlobalFoundries in East Fishkill, NY. A graduate from Rensselaer Polytechnic Institute, he joined IBM Microelectronics in 1980 and has worked on a variety of research and development projects and process sectors including: reactive ion etching, epitaxial film growth, process integration and thin film processing. During his tenure there, he co-authored over 25 technical journal papers and has over 100 issued US patents.
Bibliographische Angaben
- Autor: Krishna Seshan
- 2018, 4. Aufl., 470 Seiten, Maße: 15,2 x 22,9 cm, Taschenbuch, Englisch
- Herausgegeben: Krishna Seshan, Dominic Schepis
- Verlag: William Andrew
- ISBN-10: 0128123117
- ISBN-13: 9780128123119
- Erscheinungsdatum: 27.02.2018
Sprache:
Englisch
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